Circuit device and manufacturing method thereof
US7315083B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2005 |
| Grant date | Jan 1, 2008 |
| Priority date | — |
| Expiry date | May 31, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid integrated circuit device of the present invention and a manufacturing method thereof, a first conductive film is laminated on a first insulating layer, and a first wiring layer is formed by patterning the first conductive film. Next, a second conductive film is laminated on a second insulating layer. Thereafter, by partially removing the second insulating layer and the second conductive film in a desired spot, a connection part for connecting the wiring layers to each other is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.