Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same
US7315226B2 · kind B2 · utility
4Cited by
10References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2003 |
| Grant date | Jan 1, 2008 |
| Priority date | — |
| Expiry date | Sep 2, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0237
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electromagnetic waves leaking from a power distribution circuit provided on a printed wiring substrate or in a semiconductor package are suppressed, and degradation of the waveform of a signal generated by a high-speed digital circuit. A strip line device comprises an elongated metal plate (10) having a valve action and coated with a dielectric film (20). A conductive layer (30) is formed to cover the valve-acting metal, with the dielectric film (20) interposed therebetween. The characteristic impedance as seen from its input terminal can be low over a wide range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.