Heat-generating component cooling structure
US7315450B2 · kind B2 · utility
7Cited by
16References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2005 |
| Grant date | Jan 1, 2008 |
| Priority date | — |
| Expiry date | Apr 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat-generating component cooling structure includes a hollow heat sink having a portion made of a thermally conductive material. The heat sink has an interior path extending from first to second ends of the heat sink. A fan device is disposed at the first end of the heat sink and is adapted to cause air to flow through the interior path. Fins are disposed in the path in the heat sink. Heat-generating components of an electrical circuit are mounted on an outer surface of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.