Active matrix substrate, a manufacturing method of the active matrix substrate
US7316964B2 · kind B2 · utility
18Cited by
10References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 9, 2005 |
| Grant date | Jan 8, 2008 |
| Priority date | — |
| Expiry date | Dec 30, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A manufacturing method of a thin film apparatus, includes: a first step for forming a separation layer on a heat resistant substrate; a second step for forming a thin film device on the separation layer; a third step for providing a surface layer on the thin film device; and a fourth step for generating a peeling phenomenon at the interface of the separation layer and the heat resistant substrate so as to peel the heat resistant substrate from a side of the thin film device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.