Resin composition for a sheet molding compound and method therefor
US7317049B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2002 |
| Grant date | Jan 8, 2008 |
| Priority date | — |
| Expiry date | May 6, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/0008
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A sheet molding compound used for the preparation of enclosures comprising a base resin in a range from 20.0 to 28.0% by weight; a thermoplastic resin in a range from 3.0 to 7.0% by weight; a styrene monomer in a range from 0.01 to 2.5% by weight; a first catalyst in a range from 0.1 to 0.7% by weight; a second catalyst in a range from 0.01 to 0.3 % by weight; a catalyst modifier in a range from 0.01 to 0.25% by weight; an inhibitor in a range from 0.01 to 0.25% by weight; a UV absorber in a range from 0.01 to 0.25% by weight; a wetting agent in a range from 0.1 to 1.00% by weight; a zinc stearate in a range from 1.0 to 2.0% by weight; optionally, at least one pigment in a range from 1.0 to 8.0% by weight; a flame retardant in a range from 30.0 to 73.0% by weight; a thickener in a range from 0.1 to 1.0% by weight; a glass fiber in a range from 10.0 to 30.0% by weight; and a thermoplastic powder in a range of 0.1 to 2.5% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.