Pressure sensor
US7318351B2 · kind B2 · utility
20Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2005 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Nov 11, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y80/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor is constructed of a plastic package. The plastic package incorporates in the same material a sensing diaphragm including tensile and compression regions. Deposited on the diaphragm are metal electrodes and a polymer film having piezoresistive properties. The electrodes and/or the polymer film are directly printed onto the plastic package without the use of a mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.