Glued lost foam casting pattern assembly
US7318468B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | May 9, 2006 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Jul 7, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Lost foam pattern assemblies formed by gluing together a plurality of EPS foam pattern segments with a polystyrene-like glue comprising an aromatic resin that has a molecular weight less than 10,000 and thermally degrades at temperatures no greater than said EPS. The glue contains sufficient first plasticizer, miscible with the resin, to impart a viscosity of about 0.1 to 5 PaS @ about 100-135° C. to the glue. The glue may optionally include a second, limited-miscibility, plasticizer to accelerate the hardening rate and increase the ultimate rigidity of the glue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.