Heat-flux based emissivity/absorptivity measurement
US7318671B1 · kind B1 · utility
11Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2005 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Dec 27, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A mechanism and method for directly observing data from which the thermal emissivity or absorptivity of a surface can be calculated. The invention teaches the use of a substantially planar heat-flux or heat-flow sensor employing a thermopile, to measure the rate of heat dissipation from a radiating surface thermally attached to one side of the heat-flux sensor where the radiating surface is exposed to a first temperature and where the second side of the heat flux sensor is in thermal contact with a heat source at a second higher temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.