Molding-system platen
US7318721B2 · kind B2 · utility
8Cited by
7References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2006 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Sep 6, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed are molding-system platens, molding systems that include the molding-system platens, and a method of a molding-system platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.