Burn-in sockets for BGA IC devices having an integrated slider with full ball grid compatibility
US7318736B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 8, 2006 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Aug 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/193
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A slider 24 that integrates adaptor alignment and anti-stick features is shown for use in a socket for mounting BGA type IC devices for burn-in tests. Slider 24 has a top wall surface 14b formed with a plurality of apertures in a grid array defined by intersecting ribs 14e, 14f. A plurality of wall extension portions 14h are formed extending upwardly from portions of x-direction ribs that serve as fine alignment features with an IC device 2 adapted to be placed on the flat top end surface of the wall extension portions between rows of IC device solder ball terminals 2a. Anti-stick fingers 24c extend in the x-direction from wall extension portions 24b along a y-direction rib defining the outer limit of the first column 14s of apertures of the main grid. A concave surface 24d is formed in each finger facing wall portions 24b and the height of wall portions 24b is limited to a location below the position of solder balls of an IC device mounted in the socket to provide clearance for a mechanical support ball positioned in the first column of apertures next to wall extension portion 24b outside the main grid field to provide full grid array capability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.