Resin coated flexible substrates for printing high temperature resistant images
US7318952B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 17, 2004 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Mar 3, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Disclosed are resin coated flexible substrates, such as labels, including spine labels for CDs and DVDs which are adapted for thermal transfer printing, methods for preparing and printing on these resin coated flexible substrates and the printed substrates obtained therefrom. The printed substrates have images which are stable even when subjected to the heat and abrasion from a process which provides a shrink-wrap over the printed substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.