Microwave packaging with indentation patterns
US7319213B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2005 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Sep 27, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S99/14
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Indentation patterns in microwave packaging materials can enhance the baking and browning effects of the microwave packaging materials on food. The indentation patterns can provide venting to either channel moisture from one area of the food product to another, trap moisture in a certain area to prevent it from escaping, or channel the moisture completely away from the food product. The indentation patterns can cause the microwave packaging material underneath a food product to be slightly elevated above the cooking platform in the base of a microwave. The indentation patterns can lessen the heat sinking effect of the cooking platform by providing an air gap for insulation. Elevating the base of the microwave packaging material further allows more incident microwave radiation to propagate underneath the microwave packaging material to be absorbed by the food product or by microwave interactive materials in the microwave packaging material that augment the heating process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.