Thin film coil and method of forming the same, and thin film magnetic head and method of manufacturing the same
US7319572B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 20, 2004 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Aug 3, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/0046
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided are a thin film coil formed at high densities, a method of forming a thin film coil, a thin film magnetic head which includes the thin film coil and thus enables ensuring stable recording characteristics while coping with a higher recording density, and a method of manufacturing a thin film magnetic head. The thin film coil includes a first coil having a top surface having the maximum width, an insulating wall formed by selectively etching an insulating layer filling a region between windings by using the first coil as a mask, and a second coil isolated from the first coil by the insulating wall. This easily enables forming the thin film coil in a narrower space, while ensuring electrical insulation between the windings of the first and second coils.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.