Heat dissipation device
US7319588B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 25, 2006 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Jul 24, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation assembly includes a printed circuit board, first and second heat dissipation units each defining a channel therein and a heat pipe. The printed circuit board has an electronic heat-generating component mounted thereon. The first heat dissipation unit is attached to a top surface of the heat-generating component. The second heat dissipation unit has a main portion disposed beneath the printed circuit board and another portion extending from a level beneath the printed circuit board to another level above the printed circuit board. The heat pipe is wholly disposed above the printed circuit board and comprises an evaporating portion rotatably received in the channel of the first heat dissipation unit and a condensing portion rotatably received in the channel of the second heat dissipation unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.