Heat exchanger
US7320361B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2005 |
| Grant date | Jan 22, 2008 |
| Priority date | — |
| Expiry date | Apr 14, 2026 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D9/0062
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A known heat exchanger has a lower rate of blocking the movement of moisture through the joint as compared to a joint bonded with a moisture impermeable adhesive because the corrugated and flat substrates are bonded with thermoplastic fibers by performing heating and pressurizing treatments, but has insufficient moisture permeability because both the flat substrate, which is a partition, and the corrugated substrate, which is a space retaining plate, have a poor moisture permeability.In a heat exchanger in which two types of air flows are directed across a moisture permeable partition plate spaced apart from an adjacent partition plate by a space retaining plate, and perform heat exchange between them through the partition plate, a joint is formed by bonding the partition plate and the space retaining plate using fluoro-resin or hydrocarbon resin containing a hydrophilic group to provide an excellent moisture absorption and diffusion property.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.