Linear split axis wire bonder
US7320424B2 · kind B2 · utility
1Cited by
23References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2005 |
| Grant date | Jan 22, 2008 |
| Priority date | — |
| Expiry date | Aug 14, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance system translates the bonding tool in a vertical direction and translates the bonding tool along a first horizontal axis. A work table supports at least one semiconductor device to be wire bonded. A work table conveyance system translates the semiconductor device along a second horizontal axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.