Manifold plug for an injection molding apparatus
US7320590B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2005 |
| Grant date | Jan 22, 2008 |
| Priority date | — |
| Expiry date | Oct 19, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2889
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection molding apparatus includes a manifold having a manifold channel for receiving a melt stream of moldable material under pressure and delivering the melt stream to a nozzle channel of a nozzle. The manifold includes a manifold plug fit within a bore thereof and having a plug melt channel for fluidly connecting the manifold melt channel and the nozzle melt channel. The manifold plug further includes a valve/pressure disk portion that abuts with a back plate of the injection molding apparatus to maintain the spacing therebetween and to accommodate thermal expansion of the manifold relative to the back plate. In an injection molding application utilizing a valve-gated nozzle, the manifold plug may further include a valve pin receiving/guiding bore that functions as a valve pin bushing for a valve pin. A mold cavity communicates with the nozzle channel of the nozzle to receive melt through a mold gate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.