Method for encapsulation of a chip card and module obtained thus
US7320738B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2003 |
| Grant date | Jan 22, 2008 |
| Priority date | — |
| Expiry date | Apr 16, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1057
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the microchip has a geometric shape compatible with a recess in a card provided to accommodate it and has a means serving as a mask compatible with the card. Ultimately this mask also serves to prevent an outflow of a resin coating used to protect a chip included in this type of module. The mask is glued to a support having, on a first face, the contact area, and on a second face the mask and the chip. The mask includes a window determining the placement of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.