Patent · US Expired

LED package assembly with datum reference feature

US7321161B2 · kind B2 · utility

53Cited by
4References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 19, 2003
Grant dateJan 22, 2008
Priority date
Expiry dateFeb 1, 2024

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/12041

Abstract

An LED package includes a datum reference feature that is external to the insulating body of the LED package and has a known, fixed relationship to the heat sink. The LED die is mounted to the heat sink such that the LED die has a fixed relationship to the heat sink. Accordingly, the reference datum feature provides a frame of reference to the position of the LED die within the LED package. The reference datum feature may be mounted to the heat sink or integrally formed from the heat sink. A pick-and-place head holds the LED package by engaging the datum reference feature, e.g., with an alignment pin. In addition, the LED package may include a lead that extends laterally into the insulating body, and extends towards the LED die to reduce the vertical distance between the lead and the LED die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.