Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
US7321169B2 · kind B2 · utility
1Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2005 |
| Grant date | Jan 22, 2008 |
| Priority date | — |
| Expiry date | Dec 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a protrusion group composed of a plurality of first protrusions arranged on a mounting surface with predetermined gaps; a plurality of second protrusions for burying spaces between the neighboring first protrusions; and conductive members provided on protruding surfaces of the plurality of first protrusions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.