Computerized deformation analyzer
US7321365B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2005 |
| Grant date | Jan 22, 2008 |
| Priority date | — |
| Expiry date | Dec 16, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/23
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
According to one embodiment of the invention, a method for determining deformation of a surface of a material is provided. The method includes receiving, at a computer, an elastic deformation range and a plastic deformation range of the material. The method also includes modeling a region of the material with a mesh. The mesh includes a plurality of elements. The method also includes determining, by performing a finite element analysis on the mesh by the computer, a displacement for at least one point on each of the elements. The displacement results from a set of modeled boundary conditions. The finite element analysis includes recurrently approximating the modulus of elasticity for each element according to the elastic deformation range and the plastic deformation range. The act of approximating is based on a value of strain calculated from a previously calculated element displacement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.