Heat sink module for an electronic device
US7321492B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2005 |
| Grant date | Jan 22, 2008 |
| Priority date | — |
| Expiry date | Dec 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a heat sink module for an electronic device, comprising a substrate having at least a fixed hole, at least a heat sink fin set disposed on the substrate and having a plurality of heat sink fins and at least a resilient plate disposed on the substrate and having at least a mount hole mounting the substrate on an electronic device component in the electronic device in coordination with the fixed hole so that the substrate can be closely bonded to a surface of the electronic component. Further, since the heat sink fin set is formed on the substrate by punching method, an advantage of low cost of the heat sink module is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.