Patent · US Expired

Method for manufacturing a head stack assembly

US7322094B2 · kind B2 · utility

1Cited by
3References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 27, 2004
Grant dateJan 29, 2008
Priority date
Expiry dateSep 9, 2025

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T83/0577
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A head stack assembly of a disk drive unit including a head arm assembly (HAA) having a head gimbal assembly, a drive arm to be connected with the head gimbal assembly; wherein the drive arm comprises a securing portion, a connection portion and a spacer connecting the securing portion with the connection portion. In the present invention, at least one undercut is formed on the spacer of the drive arm to strengthen the drive arm. The invention also discloses a method of manufacturing such a head stack assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.