Apparatus for fluid pressure imprint lithography
US7322287B2 · kind B2 · utility
23Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2004 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Aug 25, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/945
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Improved apparatus for imprint lithography involves using direct fluid pressure to press a mold into a substrate-supported film. Advantageously the mold and/or substrate are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing can be accomplished by sealing the mold against the film and disposing the resulting assembly in a pressurized chamber. The result of this fluid pressing is enhanced resolution and high uniformity over an enlarged area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.