Method and system for sizing a load plate
US7323358B1 · kind B1 · utility
19Cited by
20References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 13, 2003 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | May 31, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is adjusted to cause the load plate to provide a target load when installed in the ASIC assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.