Sensor module

US7323766B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Kurt Weiblen · Metzingen, DE
• Franz Schmich · Pfullingen, DE
• Harald Emmerich · Tübingen, DE
• Klaus Offterdinger · Stuttgart, DE
• Hansjoerg Beutel · Pfullingen, DE
• Johann Wehrmann · Stuttgart, DE
• Florian Grabmaier · Rötteln, DE

Key dates

• Filing date: Nov 4, 2004
• Grant date: Jan 29, 2008
• Expiry date: Jan 10, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.