Top via pattern for bond pad structure
US7323784B2 · kind B2 · utility
9Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2005 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Mar 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Top via pattern for a bond pad structure has at least one first via group and at least one second via group adjacent to each other. The first via group has at least two line vias extending in a first direction. The second via group has at least two line vias extending in a second direction different from said first direction. The line via of the first via group does not cross the line via of the second via group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.