Probe having a frame to align spring pins perpendicularly to a printed circuit board, and method of making same
US7323892B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2006 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Jun 7, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2808
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a probe for probing test points on a target board includes a printed circuit board, a frame, and a plurality of spring pins. The printed circuit board (PCB) has a first side with a plurality of solder pads thereon, and a plurality of signal routes that are electrically coupled to the solder pads for routing signals to a test instrument. The frame is mechanically coupled to the PCB and has a main body portion with a plurality of holes therein. The holes in the frame are aligned with the plurality of solder pads on the first side of the PCB. The plurality of spring pins are provided for probing the test points on the target board, with each spring pin being i) disposed in one of the holes in the frame, perpendicularly abutting the first side of the PCB, and ii) electrically coupled to one of the solder pads. Other embodiments, including a method of making a probe, are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.