Method and apparatus for placing ID tags in molded articles
US7323990B2 · kind B2 · utility
12Cited by
12References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 23, 2005 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Oct 20, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/04
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A thermoforming apparatus and method are provided. An identification tag such as a radio frequency identification tag is provided for molding into or attaching to a thermoformed article during the thermoforming process. The tag may be attached to the article by mechanical interlocking and/or a heat sensitive adhesive. The identification tag is applied to the article while the article is being formed in the thermoforming mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.