Electronics assembly and heat pipe device
US7324341B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 22, 2005 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Apr 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronics assembly is provided having a heat pipe device for cooling electronics. The assembly includes a substrate and an electronics package supported on the substrate. The assembly also includes a heat pipe device in thermal communication with an exposed surface of the electronics package. The heat pipe device includes a thermal conductive pipe having an internal volume and an open end. The heat pipe device also includes a thermal conductive end cap positioned to close the open end of the pipe. The end cap has an outer surface for receiving in thermal communication an electronics package. The heat pipe device further includes a cooling fluid disposed in the internal volume of the pipe for transferring thermal energy from the end cap to the outside environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.