Methods and systems for laser processing a workpiece and methods and apparatus for controlling beam quality therein
US7324571B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2006 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | May 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/08072
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser processing methods, systems and apparatus having a super-modulating power supply or pumping subsystem and high beam quality (i.e., brightness) are disclosed. The methods, systems and apparatus have significant benefits, improved operation characteristics and material processing capability over currently available methods, systems and apparatus. In at least one embodiment, the beam quality of a high power solid state laser is improved in the presence of thermal lensing. High power laser cutting, scribing, and welding results are improved with a combination of modulation and high beam quality while providing for improved processing speeds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.