Silicon packaging for opto-electronic modules
US7324716B2 · kind B2 · utility
15Cited by
8References
28Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2004 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Dec 30, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0833
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An opto-electronic apparatus comprising a base layer, one or more photonic elements positioned on the base layer, and an optical layer suspended over the base layer, the optical layer including a moveable optical element positioned over at least one of the photonic elements. A process comprising forming a base layer, placing one or more photonic elements on the base layer, and suspending an optical layer over the photonic elements on the base layer, the optical layer including a moveable optical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.