Sub-application layer data transfer in a network comprising a layered architecture
US7325070B1 · kind B1 · utility
2Cited by
3References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2002 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Jun 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L69/22
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
The invention provides a system and a method for splicing network connections. In one embodiment, the method maintains first and second connections with first and second network nodes respectively; and selectively splices the first and second nodes based on application header information associated with inbound data packets received from the first node in reply to a request from the second node.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.