Apparatus and method for processing a substrate
US7326302B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2004 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | Feb 5, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/162
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for processing a substrate has a liquid supply unit, a nozzle unit, a first valve and a second valve. The liquid supply unit has an output port and an input port, and a processing liquid is output from the output port. The nozzle unit has a first port and a second port, and the first port is connected to the output port of the liquid supply unit. The first valve is connected between the second port of the nozzle unit and the input port of the liquid supply unit. The second valve is connected between the second port of the nozzle unit and the output port of the liquid supply unit. Moreover, the switch states of the first and second valves are opposite in order to control whether the nozzle unit spreads the processing liquid on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.