Rhodium electroplated structures and methods of making same
US7326327B2 · kind B2 · utility
24Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2003 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | Oct 14, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing agent does not appreciably decrease the wear resistance or hardness of the plated rhodium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.