Sensor and cap arrangement
US7326932B2 · kind B2 · utility
14Cited by
12References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2005 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | Aug 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides a sensor element formed in a first substrate and at least one optical element formed in a second substrate, the first and second substrates being configured relative to one another such that the second substrate forms a cap over the at least one sensor element, the at least one optical element being configured to guide incident radiation on the cap to the at least one sensor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.