Semiconductor package
US7327006B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2005 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | Aug 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a combination die embedded in a base. The combination die includes a plurality of functional blocks, where the functional blocks are insulated from one another on the combination die. Each functional block has plural die connectors. The base includes insulating layers conductive layers and vias. Each conductive layer has parts removed to form a pattern. The base is provided with a plurality of external connectors. A conductive path, made from a part of at least one of the conductive layers and at least one of the vias, connects one of the die connectors to a respective one of the external connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.