Assembly, contact and coupling interconnection for optoelectronics
US7327022B2 · kind B2 · utility
28Cited by
37References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2002 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | Mar 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip interconnection by microwave electrical, optical guided and unguided waves, and power or bias electrical contacts or interfaces by a novel chip in flexible circuit, rigid or inflexible embodiments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.