Semiconductor package and a method for producing the same
US7327041B2 · kind B2 · utility
9Cited by
16References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 2002 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | Aug 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes: a semiconductor chip having circuits formed on a surface, and having a thickness of 0.5 μm or more and 100 μm or less; and an adhesive resin layer provided so as to cover the surface of the semiconductor chip on which the circuits are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.