Assembly of semiconductor device, interposer and substrate
US7327554B2 · kind B2 · utility
21Cited by
15References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2004 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | Apr 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly includes a semiconductor device having surface-connecting terminals, a substrate having surface-connecting pads, and a capacitor having an approximately plate-shaped capacitor main body having a first surface on which the semiconductor device is mounted and a second surface at which the capacitor main body is mounted on the substrate and a plurality of electrically conductive vias penetrating the capacitor main body between the first and second surfaces and connected to the surface-connecting terminals and the surface-connecting pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.