Anisotropic heat spreading apparatus and method for semiconductor devices
US7328508B2 · kind B2 · utility
6Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2005 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | Jun 21, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/236
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat spreading apparatus for use in cooling of semiconductor devices includes a frame having a plurality of individual cells formed therein, each of the cells configured for filling with a material of selected thermal conductivity therein. The selected thermal conductivity of material within a given one of the cells corresponds to a thermal profile of the semiconductor device to be cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.