Thermal print head temperature estimation system
US7328980B2 · kind B2 · utility
1Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2006 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | Sep 20, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/355
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method estimates the temperature of a thermal print head element during printing. In one embodiment, the temperature is estimated using the resistance of the thermal print head element, which typically changes with the print head element temperature. The change in resistance of the print head element is exploited to indirectly estimate the temperature of the print head element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.