Method of manufacturing chemical mechanical polishing pad
US7329174B2 · kind B2 · utility
30Cited by
11References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2006 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | Sep 15, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate.The method comprising either one of a group of steps (A) and a group of steps (B), the group of steps (A) including
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.