Controlling the hardness of electrodeposited copper coatings by variation of current profile
US7329334B2 · kind B2 · utility
3Cited by
8References
15Claims
0Family size
Inventors
Key dates
| Filing date | Sep 16, 2004 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | May 7, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Pulse reverse electrolysis of acid copper solutions is used for applying copper deposits of a controlled hardness for applications such as producing printing cylinders. The benefits include improved production capacity. Hardness of the deposit is controlled by varying at least one factor selected from the group consisting of (i) cathodic pulse time, (ii) anodic pulse time, (iii) cathodic pulse current density, and (iv) anodic pulse current density. Preferably the ratio of cathodic pulse time to anodic pulse time is varied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.