Molding method, cooling apparatus and optical element
US7329378B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2005 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | Mar 23, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/808
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There is described a molding method for molding a product, having a microscopic structure of high aspect ratio. The molding method includes the steps of: setting a temperature of a mold, having a microscopic shape, at a value higher than a glass transition temperature of a material being deformable with heat; pushing the mold against the material at a first velocity, after the material is positioned opposite to the mold so that the microscopic shape contacts the material; pushing the mold against the material at a second velocity being faster than the first velocity; and releasing the mold from the material. The pushing pressure for pushing the mold against the material at the first velocity is equal to or smaller than a half of that for pushing the mold against the material at the second velocity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.