Heat-conductive silicone composition
US7329706B2 · kind B2 · utility
29Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2002 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | Sep 1, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.