Modified epoxy resins
US7329711B2 · kind B2 · utility
0Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2002 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | Dec 25, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to molding compositions comprising
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.