Sensor module
US7331212B2 · kind B2 · utility
22Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2006 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Apr 28, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P1/023
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.