Process for protectively coating hydraulic microcircuits against agressive liquids, particularly for an ink jet printhead
US7332100B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2003 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Nov 10, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/164
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Process for protectively coating against aggressive liquids hydraulic microcircuits made in a resin, particularly for an ink jet printhead, consisting of: disposing of a silicon substrate comprising a sacrificial layer of copper, deposited on the substrate and defining the inner shape of the hydraulic microcircuits; depositing on top of the outer surface of the sacrificial layer, by means of an electrochemical process, at least one protective, metallic coating layer; applying on the sacrificial layer a non-photosensitive epoxy or polyamide resin, having a predetermined thickness and suitable for completely covering the sacrificial layer; effecting a polymerization of the resin to increase its mechanical resistance to mechanical and thermal stresses and performing a planarization of the outer surface of the resin, by means of a mechanical lapping and simultaneous chemical treatment; removing the sacrificial layer through a chemical etching in a highly acid bath; and depositing a metallic, protective layer on the outer surface of the resin through vacuum evaporation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.