Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same
US7332231B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2004 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Oct 6, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249956
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ceramic substrate for a thin film electronic component, a production method thereof, and a thin film electronic component using the ceramic substrate A first substrate (1) includes a dense glass-ceramic mixed layer (33) containing glass in its surface portion. A second substrate is prepared such that a glass layer (32) formed on a surface of a substrate base portion (2) is subjected to a heat-pressure treatment so as to form or rather partly change the glass portion (32) into a dense glass-ceramic mixed layer (33) in which glass is dispersed into a surface portion of the substrate base portion (2). A surface of the dense glass-ceramic mixed layer (33) is then subjected to grinding or rather polishing to flatten and expose a surface of the dense glass-ceramic mixed layer (32). A third substrate includes a substrate base portion (2) having a dense glass-ceramic mixed layer (33) containing glass on a surface portion in one face side, and a wiring pattern (21) formed inside the substrate base portion (2). In the wiring pattern (21), one end thereof is exposed on or from a surface of the dense glass-ceramic mixed layer (33) and the other end is exposed on or from another surface of th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.